Title :
Prediction of Device Reliability by Mechanisms-of-Failure Principles
Author_Institution :
ARINC Research Corporation, Washington, D.C. 20006
Abstract :
CONSTRUCTION of novel devices for space-age missions requires a new approach to the assessment of reliability of such devices and their components. The method suggested in this paper describes performance characteristics and failure mechanisms of a device in probabilistic terms. Environmental and stress conditions applicable to the device, and its performance and strength characteristics, are expressed in the form of multidimensional probability distributions. By joint evaluation of these probability distributions, a quantitative estimate of the reliability of the device can be obtained.
Keywords :
Contacts; Failure analysis; Human factors; Information analysis; Manufacturing processes; Multidimensional systems; Probability distribution; Reliability engineering; Stress; Switches;
Conference_Titel :
Physics of Failure in Electronics, 1964. Third Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1964.362288