Title :
Millimeter-wave integrated waveguides on silicon
Author :
Gentile, G. ; Dekker, R. ; de Graaf, P. ; Spirito, M. ; de Vreede, L.C.N. ; Rejaei, B.
Author_Institution :
Elca Group, Tech. Univ. Delft, Delft, Netherlands
Abstract :
An integrated waveguide realized on (high resistivity) silicon using an IC-compatible process is reported in this work. The manufacturing process flow is based on substrate transfer technique and KOH etching, giving the resulting waveguide a trapezoidal cross-section. For this structure, the analysis of the propagating modes described here shows that it is possible to define a TE10-like mode, whose field distribution strongly resembles the classical TE10 mode of a rectangular waveguide. The cut-off frequency of the first higher order mode is also analyzed for different waveguide aspect ratios (width over height). In the fundamental mode operation, extremely low losses smaller than 0.12 dB/mm up to 50 GHz and 0.3 dB/mm up to 100 GHz are obtained respectively for a waveguide with cut-off 35 GHz and 77 GHz.
Keywords :
dielectric-loaded waveguides; elemental semiconductors; etching; millimetre wave integrated circuits; potassium compounds; rectangular waveguides; silicon; substrate integrated waveguides; IC-compatible process; KOH; KOH etching; Si; cut-off frequency; field distribution; frequency 35 GHz; frequency 77 GHz; manufacturing process flow; millimeter wave integrated waveguides; rectangular waveguide; substrate transfer technique; trapezoidal cross-section; Cutoff frequency; Frequency measurement; Loss measurement; Rectangular waveguides; Silicon; Substrates; Waveguide transitions; Millimeter-wave interconnects; dielectric filled waveguide; low losses; silicon-on-glass; substrate integrated waveguide (SIW); substrate transfer; transmission lines IC compatible;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2011 IEEE 11th Topical Meeting on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-8060-9
DOI :
10.1109/SIRF.2011.5719314