Differential and extrapolation techniques for extracting dielectric loss of printed circuit board laminates

Summary form only given, as follows. The experimental techniques to extract dielectric loss of PCB laminates, while separating dielectric and conductor losses on rough copper foils, is based on the analysis of frequency components in dielectric and conductor losses. Smooth conductor loss behaves as sqrt(omega), while dielectric loss behaves as omega and omega^2. However, conductor roughness behaves as sqrt(omega), omega, and omega^2, and these contributions may be lumped into the dielectric loss. A few examples are presented.