Title :
Unsteady thermal behaviour of electronic chips inside FC-72 cooled channel
Author :
Bhowmik, H. ; Tou, K.W. ; Tso, C.P.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ.
Abstract :
Experimental analysis of transient natural convection heat transfer from a four-in-line chip module that are flush-mounted to one wall of a vertical rectangular channel are performed for the liquid coolant of FC-72. The heat flux ranges from 1 kW/m2 to 6 kW/m 2. The effect of heat fluxes and chip numbers are investigated. The results indicate that the heat transfer coefficient is affected strongly by the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime. The transient correlation for overall data recommended is Nul = 0.47(Fo)-0.35(Ral)1/4
Keywords :
channel flow; coolants; cooling; multichip modules; natural convection; FC-72 cooled channel; electronic chips; experimental analysis; four-in-line chip module; heat flux; heat transfer coefficient; liquid coolant; transient correlation; transient natural convection heat transfer; unsteady thermal behaviour; Coolants; Electronic packaging thermal management; Electronics cooling; Equations; Heat transfer; Liquid cooling; Maintenance; Telecommunication computing; Temperature; Transient analysis;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Conference_Location :
Singapore
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396674
