DocumentCode

2599035

Title

The Role of Compound Formation on Semiconductor Device Reliability

Author

Selikson, B.

Author_Institution

Sylvania Electric Products, Inc., Woburn, Massachusetts

fYear

1964

fDate

Sept. 1964

Firstpage

365

Lastpage

377

Keywords

Aluminum; Bonding; Degradation; Gold; Intermetallic; Semiconductor device reliability; Semiconductor diodes; Silicon; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Physics of Failure in Electronics, 1964. Third Annual Symposium on the

Conference_Location

Chicago, IL, USA

ISSN

0097-2088

Type

conf

DOI

10.1109/IRPS.1964.362298

Filename

4207652