Title :
Underfilling flip chip packages with transfer molding technologies
Author :
Kooi, Chee Choong ; Yan, Chew Yin ; Rudge, V.A. ; Shing, Lim Szu ; Then, Edward
Author_Institution :
Assembly Technol. Dev., Intel Technol., Penang
Abstract :
This paper focuses on the exposed-die molded underfill (MUF) and overmold as underfill (OMUF) technologies for flip chip in the form of a molded matrix array package. A series of mold compounds were selected for this evaluation. MUF and OMUF parts were successfully assembled and subjected to reliability stress tests. All the materials have high MUF and OMUF assembly process yields. The evaluations showed that OMUF has a better reliability performance than that of MUF. Mold corner crack was observed in MUF. This paper discusses the relationships between package configurations, assembly processes and material physical properties for high performance MUF/OMUF technologies
Keywords :
assembling; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit yield; moulding equipment; MUF assembly process yield; OMUF assembly process yield; assembling; exposed-die molded underfill technology; flip chip packages; material physical properties; mold corner crack; molded matrix array package; overmold as underfill technology; package configuration; reliability stress test; transfer molding technologies; Assembly; Flip chip; Packaging; Paper technology; Protection; Stress; TV; Temperature; Testing; Transfer molding;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Conference_Location :
Singapore
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396683
