DocumentCode
2599336
Title
Correlation between ground bounce and radiated emission
Author
See, K.Y. ; Manish, O. ; Liu, Z.H. ; Kyaw, K.L.
Author_Institution
Nanyang Technol. Univ., Singapore, Singapore
fYear
2004
fDate
8-10 Dec. 2004
Firstpage
640
Lastpage
642
Abstract
High-speed PCB designers are facing challenges while designing electronic systems to meet the international electromagnetic compatibility (EMC) regulatory requirements. A PCB that carries high-speed circuit can radiate significant amount of electromagnetic emissions if no attention is paid on the layout of the circuit. With a practical case study, This work demonstrates that there is a strong correlation between ground bounce and radiated emissions of a high-speed circuit.
Keywords
electromagnetic compatibility; high-speed integrated circuits; network analysis; PCB design; circuit layout; electromagnetic compatibility; electromagnetic emissions; ground bounce; high-speed circuit; radiated emission; Battery charge measurement; Cables; Circuit testing; Clocks; Conductors; Delta modulation; Digital circuits; Electromagnetic compatibility; Electromagnetic radiation; Inductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN
0-7803-8821-6
Type
conf
DOI
10.1109/EPTC.2004.1396686
Filename
1396686
Link To Document