RF/microwave modeling and comparison of buried, blind and through-hole vias

Author

Ndip, Ivan N. ; John, Werner ; Reichl, Herbert

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

643

Lastpage

648

Abstract

In order to efficiently design multilayered chip packages and boards for RF/high-speed applications, a comparative study of different via configurations, as well as appropriate design measures to prevent their parasitic effects from degrading the entire system performance is needed. We present a comparison between buried, blind and through-hole vias based on their full-wave electromagnetic (EM) field simulation, equivalent circuit modeling and RF measurement results. From this comparison, design recommendations that can be used to reduce/eliminate signal degrading effects caused by these vias were deduced for frequencies up to 30GHz.

Keywords

chip scale packaging; chip-on-board packaging; electromagnetic interference; equivalent circuits; high-speed integrated circuits; integrated circuit layout; microwave circuits; printed circuits; RF modeling; blind vias; buried vias; circuit boards; equivalent circuit modeling; full-wave electromagnetic field simulation; microwave modeling; multilayered chip packages design; parasitic effects; signal degrading effects; structural via configurations; through-hole vias; Circuit simulation; Degradation; Electromagnetic fields; Electromagnetic measurements; Electromagnetic modeling; Equivalent circuits; Packaging; Radio frequency; Semiconductor device measurement; System performance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396687

Filename

1396687