Title :
Combining ATE and flying probe in-circuit test strategies for load board verification and test
Author :
Soh Ying Seah ; Ooi, Melanie Po-Leen ; Ye Chow Kuang ; Chee Sun See ; Panchadcharam, Shanti ; Demidenko, Serge
Author_Institution :
Sch. of Eng., Monash Univ., Bandar Sunway, Malaysia
Abstract :
Load board verification is normally performed by IC manufacturers on an automatic test equipment (ATE) as per of the standard test procedure prior to final test. Since test load boards are used as an interface between the automatic test equipment (ATE) and integrated circuit (IC), it is thus important to ensure that a particular load board is functioning otherwise the test integrity of all IC tested using the board will be questionable. As load boards become increasingly complex and difficult to verify accurately, IC manufacturers may need to use in-circuit testing as an addition to load board verification. Traditional in-circuit test platforms are expensive to implement due to cost in the bed-of-nails fixture. With the introduction of flying-probe in-circuit test platforms, this option is now a cost-viable solution. This paper discusses the issues that surround the combined test strategy of flying-probe in-circuit test and load board verification on an ATE. It goes on to propose a structure test strategy to combine both test platforms. Finally, the results and discussion are presented.
Keywords :
automatic test equipment; integrated circuit manufacture; integrated circuit testing; ATE; IC manufacturer; automatic test equipment; flying probe in-circuit test strategy; integrated circuit testing; load board verification; Automatic test equipment; Automatic testing; Circuit faults; Circuit testing; Fault detection; Fixtures; Integrated circuit testing; Manufacturing; Performance evaluation; Probes; automatic test equipment; flying probe; in-circuit testing; load board; verification;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2009. I2MTC '09. IEEE
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-3352-0
DOI :
10.1109/IMTC.2009.5168671