مرکز منطقه ای اطلاع رساني علوم و فناوري - Microelectronics technology and packaging

DocumentCode :

2600760

Title :

Microelectronics technology and packaging

fYear :

2008

fDate :

19-21 June 2008

Firstpage :

461

Lastpage :

462

Abstract :

Start of the above-titled section of the conference proceedings record.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on

Conference_Location :

Poznan, Poland

Print_ISBN :

978-83-922632-7-2

Type :

conf

Filename :

4600959

Link To Document :