Title :
Accelerated Humidity Tests for Plastic Encapsulated Devices
Author :
Bair, Byron L. ; Herr, Erwin A.
Author_Institution :
Semiconductor Products Department, General Electric Company, Electronics Park, Syracuse, New York
Abstract :
This late news paper presents the results of the examination of the screening effectiveness of steam pressure and boiling water stresses for rapidly evaluating potential failures on long term, accelerated humidity life testing. Studies such as these should allow the development of standard accelerated evaluation tests for assessing device design capabilities on a periodic basis and for acceptance of groups of devices. Also, it could be possible to determine the relationship between these accelerated tests and application environments.
Keywords :
Electronic equipment testing; Humidity; Life estimation; Life testing; Plastics; Semiconductor device testing; Standards development; Stress; Temperature; Time measurement;
Conference_Titel :
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1970.362443