• DocumentCode
    2601567
  • Title

    Accelerated Humidity Tests for Plastic Encapsulated Devices

  • Author

    Bair, Byron L. ; Herr, Erwin A.

  • Author_Institution
    Semiconductor Products Department, General Electric Company, Electronics Park, Syracuse, New York
  • fYear
    1970
  • fDate
    25659
  • Firstpage
    110
  • Lastpage
    114
  • Abstract
    This late news paper presents the results of the examination of the screening effectiveness of steam pressure and boiling water stresses for rapidly evaluating potential failures on long term, accelerated humidity life testing. Studies such as these should allow the development of standard accelerated evaluation tests for assessing device design capabilities on a periodic basis and for acceptance of groups of devices. Also, it could be possible to determine the relationship between these accelerated tests and application environments.
  • Keywords
    Electronic equipment testing; Humidity; Life estimation; Life testing; Plastics; Semiconductor device testing; Standards development; Stress; Temperature; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1970. 8th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1970.362443
  • Filename
    4207809