DocumentCode
2601567
Title
Accelerated Humidity Tests for Plastic Encapsulated Devices
Author
Bair, Byron L. ; Herr, Erwin A.
Author_Institution
Semiconductor Products Department, General Electric Company, Electronics Park, Syracuse, New York
fYear
1970
fDate
25659
Firstpage
110
Lastpage
114
Abstract
This late news paper presents the results of the examination of the screening effectiveness of steam pressure and boiling water stresses for rapidly evaluating potential failures on long term, accelerated humidity life testing. Studies such as these should allow the development of standard accelerated evaluation tests for assessing device design capabilities on a periodic basis and for acceptance of groups of devices. Also, it could be possible to determine the relationship between these accelerated tests and application environments.
Keywords
Electronic equipment testing; Humidity; Life estimation; Life testing; Plastics; Semiconductor device testing; Standards development; Stress; Temperature; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1970.362443
Filename
4207809
Link To Document