Title :
Factors in High Reliability Wire Bonding
Author_Institution :
Research and Development Laboratory, Fairchild Camera and Instrument Corporation, Palo Alto, California 94304
Abstract :
The production of devices with highest reliability is the result of optimum specifications on equipment and piece parts together with a process which has been selected from knowledge of how the operating variables affect the bond. This knowledge must be developed on each bonding system by a series of test samples, with suitable curves developed, which enable the engineer to select the process.
Keywords :
Bonding; Cameras; Contracts; Electric shock; Instruments; Knowledge engineering; Laboratories; Production; System testing; Wire;
Conference_Titel :
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1970.362454
