DocumentCode :
2602382
Title :
Plane bounce in high-speed single-ended signaling I/O interfaces
Author :
Oh, Dan
Author_Institution :
Rambus Inc., Sunnyvale, CA, USA
fYear :
2011
fDate :
23-26 Oct. 2011
Firstpage :
3
Lastpage :
6
Abstract :
Single-ended signaling is a popular choice for memory interface designs, due to its low pin-count requirement and slow DRAM process technology. Single-ended signaling requires a good current return path, in order to maintain high signal quality. Commonly used single-ended signaling schemes require both power and ground current return paths. In high-density memory interface systems, not all of the signals can be routed using a stripline with both power and ground planes. Using other non-stripline routing configurations can lead to voltage noise at some of the reference planes; referred to as plane bounce. This paper demonstrates that, while plane bounce may be significant in amplitude, its impact on the data signal is not as critical as previously thought. Various channel topologies are used to support this assertion.
Keywords :
DRAM chips; computer interfaces; input-output programs; DRAM process technology; channel topologies; ground current return paths; high-density memory interface systems; high-speed single-ended signaling I/O interfaces; nonstripline routing configurations; plane bounce; voltage noise; Inductance; Microstrip; Noise; Resistors; Stripline; Transmission line measurements; Voltage measurement; SSN; ground bounce; mutiple reference planes; plane bounce; reference voltage; simultaneous switching noise; supply bounce;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
ISSN :
pending
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/EPEPS.2011.6100170
Filename :
6100170
Link To Document :
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