Title :
Materials for High Temperature Integrated Circuit Testing
Author_Institution :
McDonnell Douglas Astronautics Company - East, St. Louis, Missouri
Keywords :
Circuit testing; Conducting materials; Costs; Integrated circuit testing; Laminates; Life estimation; Life testing; Nickel; Sheet materials; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1971.362498
