Title :
An Approach to Cost-Effective, Robust, Large-Area Electronics using Monolithic Silicon
Author :
Huang, Kevin ; Dinyari, Rostam ; Lanzara, Giulia ; Kim, Jong Yon ; Feng, Jianmin ; Vancura, Cyril ; Chang, Fu-Kuo ; Peumans, Peter
Author_Institution :
Stanford Univ., Palo Alto
Abstract :
We have developed an approach to build large-area electronics from monolithic silicon integrated circuits. The method used deep reactive ion etching to structure a monolithic silicon substrate into a stretchable, two-dimensional, wired network that can be expanded to cover large planar or curved surfaces to realize high-performance, large-area, monolithic silicon electronics in a cost-effective manner. This approach has applications in sensing, smart materials, electronic textile,RFID tag and microconcentrator solar cell manufacturing.
Keywords :
costing; monolithic integrated circuits; silicon; sputter etching; costing; large-area electronics; monolithic silicon integrated circuits; reactive ion etching; Capacitive sensors; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Robustness; Silicon; Spirals; Springs;
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
DOI :
10.1109/IEDM.2007.4418906
