Title :
A methodology for RF modeling of packages using IC known-loads
Author :
Ballicchia, Mauro ; Farina, Marco ; Morini, Antonio ; Rozzi, Tullio ; Turchetti, Claudio ; Orcioni, Simone
Author_Institution :
Dipt. di Ing. dell´´Inf., Univ. Politec. delle Marche, Ancona, Italy
Abstract :
The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.
Keywords :
integrated circuit modelling; radiofrequency integrated circuits; IC known-loads; RF modeling; calibration measurement; embedded device; packaged passive integrated inductor; representative matrix; Admittance; Equations; Inductors; Integrated circuit modeling; Load modeling; Symmetric matrices; Transmission line matrix methods; RFICs; de-embedding; modeling; package characterization;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100189
