A methodology for RF modeling of packages using IC known-loads

Author

Ballicchia, Mauro ; Farina, Marco ; Morini, Antonio ; Rozzi, Tullio ; Turchetti, Claudio ; Orcioni, Simone

Author_Institution

Dipt. di Ing. dell´´Inf., Univ. Politec. delle Marche, Ancona, Italy

fYear

2011

fDate

23-26 Oct. 2011

Firstpage

69

Lastpage

72

Abstract

The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.

Keywords

integrated circuit modelling; radiofrequency integrated circuits; IC known-loads; RF modeling; calibration measurement; embedded device; packaged passive integrated inductor; representative matrix; Admittance; Equations; Inductors; Integrated circuit modeling; Load modeling; Symmetric matrices; Transmission line matrix methods; RFICs; de-embedding; modeling; package characterization;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on

Conference_Location

San Jose, CA

ISSN

pending

Print_ISBN

978-1-4244-9398-2

Electronic_ISBN

pending

Type

conf

DOI

10.1109/EPEPS.2011.6100189

Filename

6100189