Title :
Studies of Bonding Mechanisms and Failure Modes in Thermocompression Bonds of Gold Plated Leads to Ti-Au Metallized Substrates
Author :
English, A.T. ; Hokanson, J.L.
Author_Institution :
Bell Telephone Laboratories, Murray Hill, New Jersey
Abstract :
An adequate gold-to-gold weld requires (1) a bonding load large enough to produce good interfacial conformity and (2) a bond interface temperature high enough to effect contaminant dispersal. Although some tradeoff between bonding load and temperature is possible, the range of successful combinations is inherently limited by the fact that one member is a thin film.
Keywords :
Bonding; Gold; Heating; Laboratories; Metallization; Plastics; Substrates; Surface cleaning; Surface contamination; Welding;
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1971.362512
