• DocumentCode
    2602731
  • Title

    Studies of Bonding Mechanisms and Failure Modes in Thermocompression Bonds of Gold Plated Leads to Ti-Au Metallized Substrates

  • Author

    English, A.T. ; Hokanson, J.L.

  • Author_Institution
    Bell Telephone Laboratories, Murray Hill, New Jersey
  • fYear
    1971
  • fDate
    25993
  • Firstpage
    178
  • Lastpage
    186
  • Abstract
    An adequate gold-to-gold weld requires (1) a bonding load large enough to produce good interfacial conformity and (2) a bond interface temperature high enough to effect contaminant dispersal. Although some tradeoff between bonding load and temperature is possible, the range of successful combinations is inherently limited by the fact that one member is a thin film.
  • Keywords
    Bonding; Gold; Heating; Laboratories; Metallization; Plastics; Substrates; Surface cleaning; Surface contamination; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1971. 9th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1971.362512
  • Filename
    4207881
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2602731