DocumentCode :
2602733
Title :
New interconnect evaluation metric for high-speed IO
Author :
Moon, Se-Jung ; Acar, Erkan ; Mellitz, Richard
Author_Institution :
Intel Corp., Hillsboro, OR, USA
fYear :
2011
fDate :
23-26 Oct. 2011
Firstpage :
81
Lastpage :
84
Abstract :
This paper proposes new frequency-domain (FD) metrics to evaluate and optimize interconnects for high-speed IO. In this paper, we focused on a spring-probe socket for interconnects and PCIe Gen3 for the high-speed IO. For design optimization, we adapted a holistic approach utilizing response surface methodology. Using the proposed metrics, the spring-probe socket design was optimized to minimize impact on the IO channel performance. In order to check the validity of the new metrics, an optimized socket design via voltage margin and timing margin from eye opening was compared.
Keywords :
high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; PCIe Gen3; frequency-domain metrics; high-speed IO; interconnect evaluation metric; response surface methodology; spring-probe socket design; Computational modeling; Design optimization; Input variables; Measurement; Scattering parameters; Sockets; RSM; design optimization; differential bus; high-speed IO; interconnect; spring-probe socket;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
ISSN :
pending
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/EPEPS.2011.6100192
Filename :
6100192
Link To Document :
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