Title :
Conductor Film Metallizations for Use in Tantalum Film Integrated Circuits
Author :
Speight, J.D. ; Gerstenberg, D. ; Basseches, H.
Author_Institution :
Bell Telephone Laboratories, Incorporated, Allentown, Pennsylvania 18103
Abstract :
The stability of evaporated conductor film/bonding layer combinations of particular interest in tantalum film technology has been investigated in air and corrosive environments at elevated temperatures. The effects of evaporation conditions, conductor/bonding layer combination, temperature of aging and pattern geometry on the rate of degradation were examined. Possible contact degradation mechanisms are discussed.
Keywords :
Aging; Bonding; Circuit stability; Conductive films; Conductors; Degradation; Geometry; Integrated circuit metallization; Integrated circuit technology; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1971.362514
