Title :
High-speed performance of Silicon Bridge die-to-die interconnects
Author :
Braunisch, Henning ; Aleksov, Aleksandar ; Lotz, Stefanie ; Swan, Johanna
Author_Institution :
Components Res., Intel Corp., Chandler, AZ, USA
Abstract :
Silicon Bridge is a dense multichip packaging architecture that enables high die-to-die interconnect density and corresponding applications. We describe the basic ideas of the concept, discuss density in the die-to-die interconnect context, and report results of electrical high-speed performance simulations, based on both two-dimensional and three-dimensional electromagnetic modeling.
Keywords :
bridge circuits; chip scale packaging; elemental semiconductors; high-speed integrated circuits; integrated circuit interconnections; silicon; three-dimensional integrated circuits; die-to-die interconnect density; electrical high-speed performance simulations; multichip packaging architecture; silicon bridge die-to-die interconnects; three-dimensional electromagnetic modeling; two-dimensional electromagnetic modeling; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; Routing; Silicon; Solid modeling; Three dimensional displays; 3D interconnects; 3D packages; electronic packages; high-speed channels; multiconductor transmission lines; signal integrity;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100196
