DocumentCode :
2602838
Title :
The Application Determines the Design, Material, Process and Package
Author :
Madland, Glen R.
Author_Institution :
Integrated Circuit Engineering Corporation
fYear :
1971
fDate :
25993
Firstpage :
216
Lastpage :
222
Keywords :
Application software; Application specific integrated circuits; Design engineering; Fabrication; Frequency; Integrated circuit manufacture; Integrated circuit packaging; Process design; Reliability engineering; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1971.362517
Filename :
4207886
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2602838
بازگشت