DocumentCode

2602852

Title

Anticipatory Test Monitors IC Supplier´s Process Control

Author

Thoennes, Gene

Author_Institution

Staff Engineer, Solid-State Technology, Sperry Flight Systems Division, Phoenix, Arizona 85002

fYear

1971

fDate

25993

Firstpage

223

Lastpage

227

Keywords

Assembly; Bonding; Contamination; Failure analysis; Integrated circuit testing; Manufacturing; Process control; Stress; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1971. 9th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1971.362518

Filename

4207887