Title :
Anticipatory Test Monitors IC Supplier´s Process Control
Author_Institution :
Staff Engineer, Solid-State Technology, Sperry Flight Systems Division, Phoenix, Arizona 85002
Keywords :
Assembly; Bonding; Contamination; Failure analysis; Integrated circuit testing; Manufacturing; Process control; Stress; Temperature; Wire;
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1971.362518
