Title :
Acceleration Factors for Environmental Life Testing of Integrated Circuits
Author :
Anolick, E.S. ; Amendola, A. ; Levitz, P.J.
Author_Institution :
IBM Components Division, East Fishkill Facility, Hopewell Junction, New York 12533
Abstract :
This paper discusses an experiment to determine acceleration factors for temperature and humidity life testing based on a single, primary mode of failure. The acceleration parameters to be evaluated are temperature, humidity, voltage and encapsulation. A model is presented that explains the observed results and this is related to defect statistics.
Keywords :
Aluminum; Ceramics; Circuit testing; Humidity; Integrated circuit interconnections; Lead; Life estimation; Life testing; Passivation; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1971.362519
