DocumentCode
2602864
Title
Acceleration Factors for Environmental Life Testing of Integrated Circuits
Author
Anolick, E.S. ; Amendola, A. ; Levitz, P.J.
Author_Institution
IBM Components Division, East Fishkill Facility, Hopewell Junction, New York 12533
fYear
1971
fDate
25993
Firstpage
228
Lastpage
232
Abstract
This paper discusses an experiment to determine acceleration factors for temperature and humidity life testing based on a single, primary mode of failure. The acceleration parameters to be evaluated are temperature, humidity, voltage and encapsulation. A model is presented that explains the observed results and this is related to defect statistics.
Keywords
Aluminum; Ceramics; Circuit testing; Humidity; Integrated circuit interconnections; Lead; Life estimation; Life testing; Passivation; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1971. 9th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1971.362519
Filename
4207888
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