• DocumentCode
    2602877
  • Title

    Performance bounds for hybrid flow lines: Fundamental behavior, practical features and application to linear cluster tools

  • Author

    Park, Kyungsu ; Morrison, James R.

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
  • fYear
    2012
  • fDate
    20-24 Aug. 2012
  • Firstpage
    371
  • Lastpage
    376
  • Abstract
    For deterministic hybrid flow lines with multiple classes of customer and no overtaking, we develop upper bounds on the customer departure times. For this general class of systems, the bounds are the most that one can deduce; examples can be constructed where equality is achieved and where it is not. We incorporate a very general class of setups and similarly obtain upper bounds. Such hybrid flow lines are natural candidates to serve as models of cluster tools in semiconductor wafer manufacturing. We use the flow lines as a starting point for the development of approximation models for a relatively new class of cluster tools with linear flow, called linear cluster tools. The approximations include issues caused by wafer transport robots and rolling setups. The resulting approximations are of good quality; they predict the just-in-time (maximum) throughput to within about 5%. Computation requires two orders of magnitude less effort than detailed simulation. They may thus be useful for fabricator simulations.
  • Keywords
    approximation theory; customer services; industrial robots; semiconductor industry; approximation models; customer classes; customer departure times; deterministic hybrid flow lines; fabricator simulations; just-in-time throughput; linear cluster tools; performance bounds; rolling setups; semiconductor wafer manufacturing; wafer transport robots; Approximation methods; Manufacturing; Robots; Semiconductor device modeling; Throughput; Upper bound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering (CASE), 2012 IEEE International Conference on
  • Conference_Location
    Seoul
  • ISSN
    2161-8070
  • Print_ISBN
    978-1-4673-0429-0
  • Type

    conf

  • DOI
    10.1109/CoASE.2012.6386460
  • Filename
    6386460