• DocumentCode
    2602946
  • Title

    Advanced simulation methodologies for SI analysis (T-IX)

  • Author

    Lamson, Mike ; Tsuk, Michael

  • Author_Institution
    Texas Instruments (Retd), USA
  • fYear
    2011
  • fDate
    23-26 Oct. 2011
  • Firstpage
    123
  • Lastpage
    124
  • Abstract
    Start of the above-titled section of the conference proceedings record.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-9398-2
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EPEPS.2011.6100204
  • Filename
    6100204
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2602946