Title :
The Use of a Diamond Heat Sink for a High Reliability Impatt Diode
Author :
Fukukawa, Y. ; Shinoda, M. ; Toyama, Y. ; Yamamoto, M. ; Yoshioka, S. ; Kazetani, K.
Author_Institution :
Fujitsu Laboratories Ltd., Nakahara, Kawasaki 211, Japan
Keywords :
Copper; Diodes; Gold; Heat sinks; Nickel; Stability; Surface resistance; Temperature; Testing; Thermal resistance;
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1972.362528
