DocumentCode

2603039

Title

The Use of a Diamond Heat Sink for a High Reliability Impatt Diode

Author

Fukukawa, Y. ; Shinoda, M. ; Toyama, Y. ; Yamamoto, M. ; Yoshioka, S. ; Kazetani, K.

Author_Institution

Fujitsu Laboratories Ltd., Nakahara, Kawasaki 211, Japan

fYear

1972

fDate

26390

Firstpage

64

Lastpage

68

Keywords

Copper; Diodes; Gold; Heat sinks; Nickel; Stability; Surface resistance; Temperature; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1972. 10th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1972.362528

Filename

4207900