DocumentCode :
2603051
Title :
Analysis of defective patterns on wafers in semiconductor manufacturing: A bibliographical review
Author :
Yum, Bong-Jin ; Koo, Jae Hoon ; Kim, Seong-Jun
Author_Institution :
Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
fYear :
2012
fDate :
20-24 Aug. 2012
Firstpage :
86
Lastpage :
90
Abstract :
The existing works on automatic detection and/or classification of clusters of defective dies on wafers is reviewed. The literature is classified into three major categories, namely, spatial randomness test, automatic cluster detection only, and automatic detection and classification of clusters. Future research directions are also discussed.
Keywords :
automatic optical inspection; dies (machine tools); image classification; pattern clustering; production engineering computing; semiconductor industry; semiconductor technology; statistical testing; automatic classification; automatic cluster detection; automatic detection; bibliographical review; defective die clusters; defective pattern analysis; semiconductor manufacturing; spatial randomness test; wafers; Clustering algorithms; Decision trees; Manufacturing; Neural networks; Pattern recognition; Semiconductor device modeling; Systematics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Automation Science and Engineering (CASE), 2012 IEEE International Conference on
Conference_Location :
Seoul
ISSN :
2161-8070
Print_ISBN :
978-1-4673-0429-0
Type :
conf
DOI :
10.1109/CoASE.2012.6386471
Filename :
6386471
Link To Document :
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