Title :
High Reliability Consumer IC´s
Author :
Feldt, James E. ; Hnatek, Eugene R.
Author_Institution :
National Semiconductor Corporation
Abstract :
We think we have demonstrated that it is both desirable and practical for an IC manufacturer to adopt controls that assure very high reliability devices for the consumer and industrial equipment. Molded packages can be made highly reliable, and with the proper production screens and QC backup, almost al l potential failures can be elimated before ship nent to the customer. We think this makes a great deal more sense than taking 20 samples from a lot and then saying, if they all pass, that the devices are reliable. Statistically, the results from such small samples are not very meaningful. But 100% stressing and testing in production is an excellent safeguard when the package is initially designed for use in adverse environments.
Keywords :
Assembly; Bonding; Costs; Electronics packaging; Lead; Military standards; Production; Temperature; Testing; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1972.362531