• DocumentCode
    2603079
  • Title

    High Reliability Consumer IC´s

  • Author

    Feldt, James E. ; Hnatek, Eugene R.

  • Author_Institution
    National Semiconductor Corporation
  • fYear
    1972
  • fDate
    26390
  • Firstpage
    78
  • Lastpage
    81
  • Abstract
    We think we have demonstrated that it is both desirable and practical for an IC manufacturer to adopt controls that assure very high reliability devices for the consumer and industrial equipment. Molded packages can be made highly reliable, and with the proper production screens and QC backup, almost al l potential failures can be elimated before ship nent to the customer. We think this makes a great deal more sense than taking 20 samples from a lot and then saying, if they all pass, that the devices are reliable. Statistically, the results from such small samples are not very meaningful. But 100% stressing and testing in production is an excellent safeguard when the package is initially designed for use in adverse environments.
  • Keywords
    Assembly; Bonding; Costs; Electronics packaging; Lead; Military standards; Production; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1972. 10th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1972.362531
  • Filename
    4207903