Title :
Macromodeling based variability analysis of an inverted embedded microstrip line
Author :
Vante Ginste, Dries ; De Zutter, Daniel ; Deschrijver, Dirk ; Dhaene, Tom ; Canavero, Flavio
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
Abstract :
A multivariate macromodel of the per unit length parameters of an inverted embedded microstrip line is built starting from a limited number of highly accurate but computationally expensive electromagnetic simulations. Besides the frequency dependency, the macromodel also encompasses the influence of a geometrical parameter that determines the shape of the cross-section of the metallic interconnect. This allows to assess the influence of the etching process through a variability analysis of the interconnect´s behavior in both frequency and time domain. The analysis is carried out via a robust Monte Carlo approach, which has been made computationally feasible thanks to the macromodeling step.
Keywords :
Monte Carlo methods; embedded systems; etching; frequency-domain analysis; integrated circuit interconnections; microstrip lines; time-domain analysis; computationally expensive electromagnetic simulations; computationally feasible; etching process; frequency dependency; frequency domain; geometrical parameter; inverted embedded microstrip line; macromodeling based variability analysis; macromodeling step; metallic interconnect; multivariate macromodel; robust Monte Carlo approach; time domain; Computational modeling; Etching; Frequency domain analysis; Integrated circuit interconnections; Microstrip; Robustness; Transfer functions;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100213
