DocumentCode :
2603365
Title :
Multilayer Board Plated-Thru-Hole Failure Mechanisms
Author :
Grabbe, Dimitry G.
Author_Institution :
President, Maine Research Corporation, Lisbon, Maine 04250
fYear :
1972
fDate :
26390
Firstpage :
188
Lastpage :
192
Keywords :
Bonding; Conductors; Contacts; Copper; Electronic components; Failure analysis; Integrated circuit interconnections; Laminates; Nonhomogeneous media; Palladium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1972.362550
Filename :
4207922
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2603365
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