DocumentCode
2603390
Title
Metallization Failures Caused by Organic Adhesives Used in Hybrid Microelectronic Devices
Author
Spriggs, R.S. ; Cronshagen, A.H.
Author_Institution
Reliability Engineer, Aerojet ElectroSystems Company, 1100 W. Hollyvale, Azusa, California 91702
fYear
1972
fDate
26390
Firstpage
201
Lastpage
203
Abstract
Failures were experienced when organic adhesives were used to mount components in hybrid devices. These failures were determined to be caused by electrochemical reactions between constituents of the epoxy materials and substrate metallization. The failure mechanisms involved and the precautions necessary for their prevention are discussed in this paper.
Keywords
Aluminum; Failure analysis; Inorganic materials; Integrated circuit interconnections; Metallization; Microelectronics; Packaging; Substrates; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1972.362552
Filename
4207924
Link To Document