DocumentCode
2603397
Title
3D via modeling simplification on multilayer mid-planes
Author
Li, Qian ; Melde, Kathleen L. ; Yeh, Gong-Jong ; Wu, Hui ; Yang, Yaochao
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
fYear
2011
fDate
23-26 Oct. 2011
Firstpage
207
Lastpage
210
Abstract
This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.
Keywords
S-parameters; circuit complexity; finite element analysis; integrated circuit modelling; three-dimensional integrated circuits; vias; 3D full-wave simulation; 3D via modeling simplification; FEXT; HFSS; cascaded structure; dramatic reduction; multilayer mid-planes; scattering parameters; simulation accuracy; simulation complexity; simulation time; small via sections; Accuracy; Computational modeling; Integrated circuit modeling; Nonhomogeneous media; Scattering parameters; Solid modeling; Three dimensional displays; Cascade Method; Signal Integrity; Simplification; Via Modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location
San Jose, CA
ISSN
pending
Print_ISBN
978-1-4244-9398-2
Electronic_ISBN
pending
Type
conf
DOI
10.1109/EPEPS.2011.6100228
Filename
6100228
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