• DocumentCode
    2603397
  • Title

    3D via modeling simplification on multilayer mid-planes

  • Author

    Li, Qian ; Melde, Kathleen L. ; Yeh, Gong-Jong ; Wu, Hui ; Yang, Yaochao

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
  • fYear
    2011
  • fDate
    23-26 Oct. 2011
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.
  • Keywords
    S-parameters; circuit complexity; finite element analysis; integrated circuit modelling; three-dimensional integrated circuits; vias; 3D full-wave simulation; 3D via modeling simplification; FEXT; HFSS; cascaded structure; dramatic reduction; multilayer mid-planes; scattering parameters; simulation accuracy; simulation complexity; simulation time; small via sections; Accuracy; Computational modeling; Integrated circuit modeling; Nonhomogeneous media; Scattering parameters; Solid modeling; Three dimensional displays; Cascade Method; Signal Integrity; Simplification; Via Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-9398-2
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EPEPS.2011.6100228
  • Filename
    6100228