Intermetallic Characterization

This is a study of bonding methods used in electronic component fabrication. One result is the formation of dynamic intermediate alloys that exhibit continual change toward an ultimate equilibrium condition. Microstructural changes are influenced by time, temperature, matrix materials, alloying elements, impurities and contaminants. The limiting strength of the bond is determined to a major extent by the conditions existent at the leading edge of the intermetallic layer as it grows into the host matrix. Characteristic growth patterns may provide the insight to a better understanding of this bonding mechanism.