DocumentCode :
2603522
Title :
Remarkable Breakdown Voltage Enhancement in AlGaN Channel HEMTs
Author :
Nanjo, Takuma ; Takeuchi, Misaichi ; Suita, Muneyoshi ; Abe, Yuji ; Oishi, Toshiyuki ; Tokuda, Yasunori ; Aoyagi, Yoshinobu
Author_Institution :
Mitsubishi Electr. Corp., Amagasaki
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
397
Lastpage :
400
Abstract :
We demonstrated a remarkable breakdown voltage enhancement in a new high-electron-mobility transistor (HEMT) with a wider bandgap AlGaN channel layer. A Si ion implantation doping technique was utilized to achieve sufficiently low resistive source/drain contacts. The obtained maximum breakdown voltage was 1650 V with a gate-drain distance of 10 mum. This result is very promising for the further higher-power operation of high-frequency HEMTs.
Keywords :
aluminium compounds; gallium compounds; high electron mobility transistors; ion implantation; wide band gap semiconductors; AlGaN; Si; breakdown voltage enhancement; ion implantation doping; resistive source-drain contacts; size 10 mum; voltage 1650 V; Aluminum gallium nitride; Chemical vapor deposition; Contact resistance; Doping; Gallium nitride; HEMTs; Ion implantation; MODFETs; Ohmic contacts; Photonic band gap;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
Type :
conf
DOI :
10.1109/IEDM.2007.4418956
Filename :
4418956
Link To Document :
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