Title :
TO-5 Discoloration and Bondability
Author_Institution :
Fairchild Semiconductor, Analog Division, 464 Ellis Street, Mountain View, Ca. 94040
Abstract :
Discoloration of electrodeposited gold on TO-5 headers after a 500°C bake has been evaluated by measuring reflected light. This method, in conjunction with ultrasonic bonding and a destructive wire pull test, has been used to establish parts bond- ability. Correlation has been found between the variation in reflectivity and bond pull strength.
Keywords :
Bonding; Failure analysis; Gold; Integrated circuit testing; Life testing; Materials reliability; Materials testing; Reflectivity; Ultrasonic variables measurement; Wire;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362563
