DocumentCode :
2603607
Title :
Integrated MEMS LC Resonator with Sealed Air-Suspended Structure for Single-Chip RF LSIs
Author :
Kuwabara, K. ; Sato, N. ; Morimura, Hiroki ; Kodate, J. ; Nakamura, M. ; Ugajin, M. ; Kamei, T. ; Kudou, K. ; Machida, K. ; Ishii, H.
Author_Institution :
NTT Corp., Atsugi
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
423
Lastpage :
426
Abstract :
This paper describes an integrated MEMS LC resonator that consists of a MEMS inductor and varactor. The resonator features a sealed air-suspended structure: the inductor and varactor are suspended above a CMOS LSI to improve their performance, and they are sealed with a film to protect them during packaging. The quality factor of the inductor is four times higher than that of a CMOS top-layer-metal inductor, and the varactor has a tuning ratio of 100% at about 5-V applied voltage. The resonator is applied to a voltage- controlled oscillator to show its effectiveness for the development of single-chip RF LSIs.
Keywords :
CMOS integrated circuits; Q-factor; inductors; large scale integration; micromechanical resonators; radiofrequency integrated circuits; varactors; voltage-controlled oscillators; CMOS LSI; MEMS inductor; integrated MEMS LC resonator; quality factor; sealed air-suspended structure; single-chip RF LSI; varactor; voltage 5 V; voltage- controlled oscillator; Large scale integration; Micromechanical devices; Packaging; Protection; Q factor; Radio frequency; Tuning; Varactors; Voltage; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
Type :
conf
DOI :
10.1109/IEDM.2007.4418963
Filename :
4418963
Link To Document :
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