DocumentCode
2603614
Title
On Measuring the Mechanical Properties of Aluminum Metallization and their Relationship to Reliability Problems
Author
Philofsky, E.M. ; Ravi, K.V.
Author_Institution
Manager, Materials Research Laboratory, Motorola, Inc., 5005 E. McDowell Road, Phoenix, Arizona 85008
fYear
1973
fDate
26755
Firstpage
33
Lastpage
40
Abstract
The mechanical properties of thin film aluminum metallization have been determined by applying a biaxial tension stress to the films. The mechanical properties were found to-vary as a function of deposition conditions. No correlation was found between the mechanical properties of the metallization and thermocompression wire bonding; however, a linear relationship was found between yield strength of the metallization and the temperature change required to cause surface reconstruction during cyclic operation.
Keywords
Aluminum; Bonding; Mechanical factors; Mechanical variables measurement; Metallization; Surface reconstruction; Temperature; Thermal stresses; Transistors; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362564
Filename
4207939
Link To Document