Title :
On Measuring the Mechanical Properties of Aluminum Metallization and their Relationship to Reliability Problems
Author :
Philofsky, E.M. ; Ravi, K.V.
Author_Institution :
Manager, Materials Research Laboratory, Motorola, Inc., 5005 E. McDowell Road, Phoenix, Arizona 85008
Abstract :
The mechanical properties of thin film aluminum metallization have been determined by applying a biaxial tension stress to the films. The mechanical properties were found to-vary as a function of deposition conditions. No correlation was found between the mechanical properties of the metallization and thermocompression wire bonding; however, a linear relationship was found between yield strength of the metallization and the temperature change required to cause surface reconstruction during cyclic operation.
Keywords :
Aluminum; Bonding; Mechanical factors; Mechanical variables measurement; Metallization; Surface reconstruction; Temperature; Thermal stresses; Transistors; Wire;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362564
