Title :
Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance
Author :
Wang, Hanfeng ; Ruehli, Albert E. ; Fan, Jun
Author_Institution :
Missouri S&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
An integral equation method used for capacitance extraction for axially symmetric geometries is extended in this paper to calculate the via-plane capacitances in shared-antipad via structures, by changing the circular ring cells to arc ones. The proposed method is validated with a commercial finite element method based tool for a typical structure used in modern high-speed printed circuit design.
Keywords :
capacitance measurement; finite element analysis; integral equations; integrated circuit interconnections; printed circuit design; capacitance calculation; capacitance extraction; circular ring cells; finite element method based tool; high-speed printed circuit design; integral equation method; partial capacitance; shared-antipad via structure; Capacitance; Geometry; Impedance; Integral equations; Integrated circuit modeling; Mathematical model; Surface impedance; integral equation method; partial capacitance; shared-antipad via structure; via-plane capacitance;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100244
