Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance

Author

Wang, Hanfeng ; Ruehli, Albert E. ; Fan, Jun

Author_Institution

Missouri S&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA

fYear

2011

fDate

23-26 Oct. 2011

Firstpage

271

Lastpage

274

Abstract

An integral equation method used for capacitance extraction for axially symmetric geometries is extended in this paper to calculate the via-plane capacitances in shared-antipad via structures, by changing the circular ring cells to arc ones. The proposed method is validated with a commercial finite element method based tool for a typical structure used in modern high-speed printed circuit design.

Keywords

capacitance measurement; finite element analysis; integral equations; integrated circuit interconnections; printed circuit design; capacitance calculation; capacitance extraction; circular ring cells; finite element method based tool; high-speed printed circuit design; integral equation method; partial capacitance; shared-antipad via structure; Capacitance; Geometry; Impedance; Integral equations; Integrated circuit modeling; Mathematical model; Surface impedance; integral equation method; partial capacitance; shared-antipad via structure; via-plane capacitance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on

Conference_Location

San Jose, CA

ISSN

pending

Print_ISBN

978-1-4244-9398-2

Electronic_ISBN

pending

Type

conf

DOI

10.1109/EPEPS.2011.6100244

Filename

6100244