Title :
Torque and Theal Cycling as Methods of Testing Reliability of Reflow-Soldered Chip-To-Substlate Joints
Author :
Ailawadhi, Manohar L. ; Kakar, Ashok K.
Author_Institution :
Control Data Corporation, Microcircuits Operation, Bloomington, Minn.
Abstract :
Reflow-Soldering technology provides a low lost, high yield interconnection scheme for packaging monolithic integerated circuits. This paper gives the reliability data on such a package, test procedures used, and discusses some of the factors which influence the reliability of the package.
Keywords :
Capacitive sensors; Circuit testing; Fatigue; Packaging; Plastics; Rapid thermal processing; Temperature; Thermal expansion; Thermal stresses; Torque;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362570
