Title :
Some Reliability Considerations of Large Hybrids
Author :
McMahon, Robert E.
Author_Institution :
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173
Abstract :
I assume that we all agree that a component does not become inherently less reliable when combined with other components, as in a hybrid, than it is singly. To think otherwise would be unscientific and perhaps even unAmerican. A component that has a particular failure rate when individually packaged should not have a higher failure rate in a hybrid assembly all things being equal. Unfortunately, not all things remain equal and perhaps that is the substance of the question before the panel.
Keywords :
Assembly; Hybrid integrated circuits; Inspection; Laboratories; Monolithic integrated circuits; Packaging; Reliability engineering; Temperature; Testing; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362573