DocumentCode :
2603796
Title :
IBM Reliability Experience With-Hybrid Microcircuits
Author :
Totta, P.A.
Author_Institution :
IBM System Products Division, East Fishkill, New York
fYear :
1973
fDate :
26755
Firstpage :
92
Lastpage :
92
Keywords :
Aluminum; Business; Electromigration; Fatigue; Hybrid integrated circuits; IEEE news; Integrated circuit interconnections; Logic circuits; Packaging; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1973.362574
Filename :
4207949
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2603796
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