DocumentCode :
2603812
Title :
Reliability of Solder-Connected, Thick-Film Hybrid Integrated Circuits
Author :
Burks, Darnall P.
Author_Institution :
Sprague Electric Company, Wichita Falls, Texas
fYear :
1973
fDate :
26755
Firstpage :
93
Lastpage :
93
Keywords :
Ceramics; Conducting materials; Hybrid integrated circuits; Integrated circuit packaging; Integrated circuit reliability; Lead; Military computing; Substrates; Thermal stresses; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1973.362575
Filename :
4207950
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2603812
بازگشت