Title :
Package Hermeticity
Author :
Adams, George E.
Author_Institution :
Motorola Integrated Circuit Center, Mesa, Arizona
Abstract :
Typical semiconductor users do not perform failure analysis on what they feel are package hermeticity problems. They usually draw their conclusions from standard fine and gross tests which may be inaccurate. The following discussion portrays methods of verifying hermeticity integrity.
Keywords :
Circuit testing; Electronic equipment testing; Failure analysis; Integrated circuit packaging; Integrated circuit testing; Nondestructive testing; Performance analysis; Performance evaluation; Semiconductor device packaging; Semiconductor device testing;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362577
