Analysis of Integrated Circuit Failure Modes and Failure Mechanisms Derived from High Temperature Operating Life Tests

A High Temperature-Operating Life Test was performed on a Hybrid Integrated Circuit Analog Switch to determine Its reliability. All failures resulting from the Life Test were analyzed to determine the cause of failure. Surface defect and intermetalic failure mechanisms were observed. The High Temperature test results were used to estimate the operational life capability of the Hybrid device. Utilizing the log-normal distribution, the Arrhenius relationship and the technique set forth by Bell Telephone Labs, an estimated component failure rate of 2.6 × 10¿3 percent per 1,000 hours was calculated.