DocumentCode

2603990

Title

Temperature-Humidity Acceleration of Metal-Electrolysis Failure in Semiconductor Devices

Author

Peck, D.S. ; Zierdt, C.H., Jr.

Author_Institution

Bell Telephone Laboratories, Inc., 555 Union Boulevard, Allentown, Pennsylvania

fYear

1973

fDate

26755

Firstpage

146

Lastpage

152

Keywords

Acceleration; Costs; Encapsulation; Failure analysis; Humidity; Moisture; Plastics; Semiconductor devices; Silicon; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1973. 11th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1973.362586

Filename

4207961