Title :
Temperature-Humidity Acceleration of Metal-Electrolysis Failure in Semiconductor Devices
Author :
Peck, D.S. ; Zierdt, C.H., Jr.
Author_Institution :
Bell Telephone Laboratories, Inc., 555 Union Boulevard, Allentown, Pennsylvania
Keywords :
Acceleration; Costs; Encapsulation; Failure analysis; Humidity; Moisture; Plastics; Semiconductor devices; Silicon; Testing;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362586
