Title :
CMOS & Interconnect Reliability - Advanced Dielectric Reliability
Author :
Pey, Kin Leong ; Furusawa, Takeshi
Author_Institution :
Nanyang Tech University
Keywords :
Copper; Dielectric breakdown; Electric breakdown; Encapsulation; Paper technology; Technology management;
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
DOI :
10.1109/IEDM.2007.4418981
