Failure Analysis Applications of Auger Electron Spectroscopy

The basic operation, advantages, and limitations of the Auger electron spectroscopy technique are discussed. Applications include simultaneous surface analysis and ion sputtering to produce a compositional-depth profile. This technique is used to study the soldering problem caused by diffusion of impurities to the surface during high temperature treatments. In analyzing wire bond problems, the elemental and chemical bonding information of the Auger signals is shown to provide identification of processing defects.