DocumentCode :
2604187
Title :
Reliability Improvements of Plastic Semiconductors using Gold Metallization
Author :
Wright, James C.
Author_Institution :
MOTOROLA, SEMICONDUCTOR PRODUCTS DIVISION, PHOENIX, ARIZONA 85062
fYear :
1973
fDate :
26755
Firstpage :
224
Lastpage :
229
Keywords :
Aluminum; Assembly; Bonding; Gold; Metallization; Plastics; Semiconductor device reliability; Silicon; Switches; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1973.362600
Filename :
4207975
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2604187
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