Title :
High-Reliability Plastic Package for Integrated Circuits
Author_Institution :
Manager, Linear IC Product Development, RCA Solid State, Somerville, N.J., 08876
Abstract :
Two orders of magnitude improvement in the reliability of plastic packages has been achieved as the result of a systematic study of basic failure mechanisms and the development of improved materials, handling procedures and process controls. This improved integrated-circuit packaging system has resulted in plastic-encapsulated product capable of matching the reliability of hermetic packages under severe environmental stress.
Keywords :
Bonding; Ceramics; Circuit testing; Failure analysis; Gold; Integrated circuit reliability; Plastic integrated circuit packaging; Plastic packaging; Plastics industry; System testing;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362602
