Title :
[Copyright notice]
Abstract :
The following topics are dealt with: energy harvesting; test cost and security; extreme ultraviolet lithography; multiple patterning lithography; cyber physical systems; network routing; random noise; leakage and technology-aware gate sizing; CMOS manufacturing-reliability; power ground networks; 3D IC reliability technology; biological system modeling; power-aware architecture; CAD; smartphones; high-performance computing systems co-design; high-level design methods; electromagnetic-based design automation; printable electronics; embedded CPU-GPU core design; analog-mixed-signal post-silicon validation; network-on-chips; logic synthesis; nanoscale analog circuit synthesis; billion-transistor VLSI designs; OLED displays; and 2D-3D physical design optimization.
Keywords :
CAD; CMOS integrated circuits; LED displays; VLSI; energy harvesting; graphics processing units; integrated circuit design; integrated circuit reliability; logic design; mixed analogue-digital integrated circuits; network routing; network-on-chip; organic light emitting diodes; parallel processing; random noise; smart phones; ultraviolet lithography; 2D-3D physical design optimization; 3D IC reliability technology; CAD; CMOS manufacturing; CMOS reliability; OLED displays; analog-mixed-signal post-silicon validation; billion-transistor VLSI designs; biological system modeling; cyber physical systems; electromagnetic-based design automation; embedded CPU-GPU core design; energy harvesting; extreme ultraviolet lithography; high-level design methods; high-performance computing systems co-design; logic synthesis; multiple patterning lithography; nanoscale analog circuit synthesis; network routing; network-on-chips; power ground networks; power-aware architecture; printable electronics; random noise; security; smartphones; technology-aware gate sizing; test cost;
Conference_Titel :
Computer-Aided Design (ICCAD), 2012 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
